This article was accepted into the corpus but its outbound wikilinks were never NER-processed — typical at the deepest BFS hop or when the run's entity cap was reached. No expansion funnel to show.
| Qualcomm Snapdragon 800 | |
|---|---|
| Name | Qualcomm Snapdragon 800 |
| Manufacturer | Qualcomm |
| Aka | APQ8064-1AA |
| Release | 2013 |
| Architecture | ARMv7-A |
| Cpu | Krait 400 |
| Gpu | Adreno 330 |
| Clock | up to 2.3 GHz |
| Process | 28 nm LP |
| Soc | Snapdragon 800 series |
Qualcomm Snapdragon 800 The Qualcomm Snapdragon 800 is a mobile system on a chip (SoC) introduced by Qualcomm in 2013 as a flagship platform powering smartphones, tablets, and multimedia devices. It combined a quad-core Krait 400 CPU, an Adreno 330 GPU, and integrated modems and multimedia accelerators to compete with contemporaries from Apple, Samsung, and MediaTek. The platform influenced device design choices across manufacturers including Samsung, LG, Sony, HTC, and Motorola, and impacted benchmark comparisons with products from Apple, NVIDIA, and Intel.
The Snapdragon 800 platform was announced by Qualcomm executives and unveiled during product briefings that referenced competitive comparisons with the Apple A6X, Apple A7, Samsung Exynos 5 Octa, NVIDIA Tegra 4, and Intel Atom. OEM partners such as HTC, Samsung, Sony, LG, Motorola, and Xiaomi adopted the SoC for flagship models. Industry analysts from Gartner, IDC, and Canalys tracked shipment impacts as carriers like Verizon Communications, AT&T, Vodafone Group, and T-Mobile US rolled out devices. Major events including Mobile World Congress and CES showcased Snapdragon 800 devices alongside announcements from Microsoft and Google about software support.
The SoC integrates a quad-core Krait 400 CPU implementing the ARM instruction set (ARMv7-A) and designed by Qualcomm to compete with in-order and out-of-order microarchitectures from Apple and Intel. The graphics subsystem, Adreno 330, traces lineage to acquisitions and partnerships involving industry players like AMD and historical IP transfers. Memory controllers supported LPDDR3 and worked with memory vendors such as Samsung and SK Hynix to achieve bandwidth goals. The fabrication at 28 nm used process technologies from fabs related to TSMC and GlobalFoundries. System architects referenced standards from JEDEC and multimedia codecs standardized by MPEG LA and ISO/IEC committees. Power, clocking, and interconnect design invoked concepts common in chips from Texas Instruments, Broadcom, and MediaTek.
Early benchmark comparisons involved suites like Geekbench, AnTuTu, and GFXBench to evaluate integer, floating-point, and graphics throughput against the Apple A6X, Apple A7, Samsung Exynos 5 Octa, and NVIDIA Tegra 4. Reviewers at outlets such as The Verge, CNET, Engadget, Ars Technica, and AnandTech published measurements showing lead in multicore integer workloads and graphics tests for real-time rendering versus contemporaries from Intel and Imagination Technologies. Gaming studios including EA, Ubisoft, and Rovio Entertainment profiled performance for titles optimized on the platform. Thermal throttling and sustained performance were assessed in lab environments referenced by UL Benchmarks and device teardown analyses from iFixit.
Snapdragon 800 combined multiple subsystems on die: the Krait CPU cluster, Adreno 330 GPU, Image Signal Processor for camera pipelines used by Sony and Samsung camera modules, a Hexagon DSP for audio and sensor processing, and integrated LTE modems interoperable with carrier equipment from Ericsson, Nokia Siemens Networks, and Huawei Technologies. Multimedia blocks supported H.264, HEVC experimentation, and audio codecs referenced by Fraunhofer Society. Connectivity features included Wi‑Fi implementations interoperable with standards bodies such as IEEE 802.11 and Bluetooth stacks used by Bluetooth SIG. Security features leveraged trusted execution concepts related to industry efforts by AMD, Intel, and standards from FIDO Alliance.
Power and thermal profiles were central to device engineering, influencing thermal designs by OEMs like HTC, Samsung, Sony, and LG. Techniques such as dynamic voltage and frequency scaling (DVFS) were implemented similarly to practices in chips from Intel and ARM. Thermal solutions ranged from passive spreaders to vapor chambers in premium devices referencing work by thermal suppliers like Delta Electronics and Nidec. Battery capacity choices from suppliers including Panasonic and Sony Energy Devices Corporation affected real-world run times measured by publications such as PCMag and Wired.
Flagship devices using the Snapdragon 800 included models from Samsung Galaxy lines, HTC One, Sony Xperia series, LG G2, and Motorola Droid variants, affecting sales tracked by Gartner and IDC. The SoC shaped app optimization strategies by major developers at Google, Facebook, Microsoft, Netflix, and game studios such as Epic Games and Unity Technologies. Carrier launches by Verizon Communications, AT&T, and T-Mobile US highlighted LTE capabilities, while OEM design wins influenced supply chains involving Foxconn, Pegatron, and Compal Electronics.
Qualcomm introduced related parts and iterative SKUs aligned with product roadmaps that led to successors like the Snapdragon 801, Snapdragon 805, and later Snapdragon 810 families; these competed with contemporaneous SoCs from Apple, Samsung Exynos families, MediaTek, and NVIDIA Tegra lines. The evolution continued toward 64-bit architectures exemplified by designs in collaboration with ARM and later Snapdragon series used in devices referenced at events like Mobile World Congress and CES.
Category:Qualcomm processors