IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology
Title	IEEE Transactions on Components, Packaging and Manufacturing Technology
Discipline	Electronics, Manufacturing, Packaging
Publisher	IEEE
Country	United States
Frequency	Monthly
History	2011–present

IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology is a peer-reviewed technical journal focused on electronic packaging, microelectronics, and manufacturing technologies. The journal serves as a venue for engineers and researchers affiliated with institutions such as Massachusetts Institute of Technology, Stanford University, Tsinghua University, University of California, Berkeley, and Georgia Institute of Technology to publish advances relevant to industry actors including Intel, Samsung Electronics, TSMC, Applied Materials, and Lam Research. Its readership spans professionals from organizations like National Institute of Standards and Technology, Oak Ridge National Laboratory, Sandia National Laboratories, Fraunhofer Society, and CEA-Leti.

History

The journal was established amid consolidation trends in scholarly publishing influenced by organizations such as Institute of Electrical and Electronics Engineers, American Society of Mechanical Engineers, and The Institute of Physics during the early 2010s. Its founding reflects parallel developments at institutions like California Institute of Technology and Purdue University in response to rapid miniaturization driven by roadmaps from International Technology Roadmap for Semiconductors and initiatives by European Commission research programs. Editorial leadership has included scholars with ties to University of Illinois Urbana-Champaign, Kyoto University, Korea Advanced Institute of Science and Technology, National University of Singapore, and Nanyang Technological University, aligning the journal with global networks such as IEEE Electron Devices Society and IEEE Components, Packaging and Manufacturing Technology Society.

Scope and Topics

The journal covers topics that intersect work at MIT Lincoln Laboratory, IBM Research, Bell Labs, CERN, and NASA Ames Research Center. Typical subject areas include substrate technologies studied at IMEC, heterogeneous integration pioneered at Intel Labs, thermal management research associated with Argonne National Laboratory, reliability testing methods from Underwriters Laboratories, and additive manufacturing approaches advanced at Wright-Patterson Air Force Base programs. Articles often relate to material science advancements from Max Planck Society partners, photonics packaging tied to Rochester Institute of Technology, sensor integration explored at SRI International, and supply-chain considerations connected to World Trade Organization discussions involving multinational corporations like Foxconn and ASE Technology Holding.

Publication and Editorial Process

Manuscripts undergo peer review coordinated by editors who have served on editorial boards alongside colleagues from University of Cambridge, University of Oxford, Harvard University, Yale University, and Columbia University. The review workflow parallels standards advocated by organizations such as Committee on Publication Ethics, National Academies of Sciences, Engineering, and Medicine, and Royal Society. Production and distribution leverage publication platforms used by the IEEE Xplore Digital Library and are indexed similarly to content from ACM, Springer Nature, and Elsevier journals. Special issue proposals are typically guest-edited by researchers from centers like EPFL, Seoul National University, and Delft University of Technology with advisory input from corporate research labs including Intel Corporation Research, Texas Instruments, and Qualcomm.

Abstracting and Indexing

Abstracting and indexing services that include the journal mirror databases that catalog publications from Nature Publishing Group, Science Magazine, Proceedings of the IEEE, and IEEE Spectrum. The journal is represented in major bibliographic resources alongside entries from Scopus, Web of Science, INSPEC, Compendex, and PubMed Central for interdisciplinary overlap. Citation tracking uses tools developed by Clarivate Analytics and Elsevier Scopus, facilitating bibliometric analysis comparable to metrics produced for publications affiliated with National Science Foundation-funded projects and Horizon 2020 initiatives.

Impact and Reception

The journal's impact is assessed in conversation with flagship titles such as IEEE Transactions on Electronic Devices, IEEE Transactions on Components and Packaging Technologies, Journal of Microelectromechanical Systems, and Microelectronics Journal. It has been cited by authors from universities like Johns Hopkins University, University of Michigan, Imperial College London, and Monash University and by researchers at industrial labs including Broadcom, NXP Semiconductors, Micron Technology, and STMicroelectronics. Policymakers and standards bodies, including IEEE Standards Association and International Electrotechnical Commission, reference work from the journal when updating guidance for packaging reliability, assembly processes, and environmental testing.

Notable Papers and Special Issues

Notable contributions have addressed three-dimensional integration developments associated with DARPA programs, wafer-level packaging advances tied to work at GlobalFoundries, and thermal interface material innovations related to studies at Sandia National Laboratories. Special issues have focused on topics coordinated with conferences such as Electronic Components and Technology Conference, International Interconnect Technology Conference, IEEE International Reliability Physics Symposium, and International Symposium on Microelectronics. Highly cited papers include collaborations among researchers from Aalto University, University of Toronto, Duke University, Technische Universität München, and Korea Institute of Science and Technology, reflecting cross-institutional efforts to address challenges in manufacturing yield, material compatibility, and system-level integration.

Category:IEEE academic journals Category:Engineering journals