Generated by GPT-5-mini| USB 3.1 | |
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![]() Originally uploaded by Caspertheghost at en.wikipedia · Public domain · source | |
| Name | USB 3.1 |
| Developer | USB Implementers Forum |
| Released | 2013 |
| Predecessor | USB 3.0 |
| Successor | USB 3.2 |
| Max speed | 10 Gbit/s |
| Connector | See section |
USB 3.1 USB 3.1 is a revision of the Universal Serial Bus specification introduced by the USB Implementers Forum in 2013 that increased data transfer rates and improved power delivery. The specification was developed alongside work by major technology companies and standards bodies and influenced laptop, peripheral, and storage device designs. Adoption intersected with developments in processor platforms, storage interfaces, and cable ecosystems across consumer electronics and enterprise hardware.
USB 3.1 was announced to supersede earlier revisions and to meet rising demands in data transfer and power management driven by companies such as Intel Corporation, Samsung Electronics, Apple Inc., Microsoft, and Dell Technologies. The specification update involved collaboration from members of the USB Implementers Forum and affected product roadmaps at firms including HP Inc., Lenovo, AsusTek Computer Inc., and Acer Inc.. Standards interactions occurred with organizations such as VESA and the USB Promoter Group while market dynamics were shaped by offerings from Seagate Technology, Western Digital, SanDisk Corporation, and Kingston Technology.
The USB 3.1 specification defined a SuperSpeed+ signaling mode with a raw bit rate of 10 Gbit/s and introduced enhanced link training, encoding, and error management features. Electrical and protocol characteristics were developed with input from chipset vendors like Intel Corporation and AMD to ensure interoperability with controller silicon used in platforms from Qualcomm, Marvell Technology Group, and Texas Instruments. The power delivery aspects aligned with early iterations of the USB Power Delivery specification and were relevant to power adapters from companies such as Anker Innovations and Belkin International. Compliance testing and certification processes were coordinated through test labs and certification bodies including UL LLC and industry consortia.
USB 3.1 supported multiple connector form factors, including the legacy Type-A and the reversible Type-C connector introduced earlier by industry groups. Device makers such as Apple Inc. and Google integrated Type-C ports into notebooks and phones—models from Google LLC and Samsung Electronics showcased adoption—while peripheral manufacturers like Logitech International S.A. and Razer Inc. built compatible devices. Cable and connector specification compliance was governed in part by members of the USB Implementers Forum and tested by certification providers; adapter products from Anker Innovations, Belkin International, and AmazonBasics sought to preserve backward compatibility with devices using connectors from previous generations.
USB 3.1’s SuperSpeed+ mode improved throughput for external solid-state storage solutions from companies such as Samsung Electronics, SanDisk Corporation, Western Digital, and Crucial Technology, enabling faster file transfers for content creation workflows using software by Adobe Systems, Avid Technology, and Autodesk, Inc.. Enhanced link management supported multi-lane strategies that influenced peripheral designs from Kingston Technology and Corsair Memory. Improvements in power delivery and charging behavior altered accessory ecosystems for smartphones and tablets by Apple Inc., Samsung Electronics, Huawei Technologies Co., Ltd., and Xiaomi Corporation, while video and audio device makers like NVIDIA Corporation and AMD leveraged the bandwidth for docking stations and external GPUs.
Major PC OEMs such as Dell Technologies, HP Inc., Lenovo, AsusTek Computer Inc., and Acer Inc. began shipping laptops and motherboards with USB 3.1-capable ports, and motherboard vendors including ASRock Inc. and MSI integrated compliant controllers. Storage vendors including Seagate Technology, Western Digital, Samsung Electronics, and SanDisk Corporation released external drives marketed for USB 3.1 performance. Mobile device makers including Samsung Electronics, Google LLC, LG Electronics, and Huawei Technologies Co., Ltd. adopted Type-C connectors and benefited from enhancements in charging and accessory interoperability. Peripheral manufacturers such as Logitech International S.A., Razer Inc., Corsair Memory, and Elgato Systems produced hubs, docks, and capture devices to exploit increased bandwidth.
Compared with earlier revisions, USB 3.1 doubled the SuperSpeed data rate relative to USB 3.0 and provided different trade-offs compared with emerging successors like USB 3.2 and protocols such as Thunderbolt 3 and Thunderbolt 4. Platform support and marketing by firms including Intel Corporation and Apple Inc. influenced real-world throughput and feature exposure. Storage and peripheral benchmarks by independent testing organizations and publications often contrasted USB 3.1 devices from vendors like Samsung Electronics, Seagate Technology, and Western Digital against NVMe over PCI Express solutions championed by chipset vendors including Intel Corporation and AMD. In docking, display, and power roles, comparisons involved standardization efforts by groups like VESA and industry implementations from Dell Technologies, HP Inc., and Lenovo.
Category:Computer buses