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| Samsung Exynos 9810 | |
|---|---|
| Name | Exynos 9810 |
| Manufacturer | Samsung Electronics |
| Family | Exynos |
| Released | 2018 |
| Cores | Octa-core |
| Process | 10 nm LPP |
| Gpu | Mali-G72 MP18 |
| Modem | Cat.18 LTE |
Samsung Exynos 9810 is a flagship mobile system-on-chip (SoC) developed by Samsung Electronics for high-end smartphones and tablets. Announced in late 2017 and deployed in 2018, it targeted performance and multimedia improvements over prior generations, aiming to compete with contemporaries from Qualcomm, Apple Inc., Huawei, MediaTek, and Intel Corporation. The SoC integrates custom CPU cores, an ARM-derived GPU, advanced image signal processing, and an LTE modem for mainstream global devices.
The Exynos 9810 uses an octa-core layout with four high-performance custom cores and four power-efficient cores, reflecting design philosophies seen in products from ARM Limited, Apple A-series, Qualcomm Snapdragon, HiSilicon Kirin, and historical work by Fujitsu on custom CPU microarchitecture. The custom cores are tuned for single-threaded throughput, microarchitectural features influenced by research from ARM Holdings and academic groups at Massachusetts Institute of Technology, Stanford University, and University of Cambridge. The SoC includes a system controller, memory controller, multimedia accelerators, and security blocks similar to those used by NVIDIA and Broadcom. Cache hierarchies and coherency follow conventions employed by JEDEC memory standards and draw on techniques discussed at conferences hosted by ACM and IEEE.
Samsung fabricated the 9810 using its 10 nm LPP (Low Power Plus) process node, a progression from earlier 14 nm FinFET and 10 nm development efforts involving Samsung Foundry and collaborations with GLOBALFOUNDRIES and TSMC. The 10 nm LPP node sought to balance density and power characteristics and referenced process maturity goals similar to those pursued by Intel Corporation in its 10 nm roadmap and by TSMC in its 7 nm planning. Yield optimization techniques and patterning strategies echo methodologies from ASML immersion and extreme ultraviolet (EUV) studies and manufacturing discussions at SEMICON events.
In synthetic and real-world evaluations, the Exynos 9810 prioritized single-core integer and floating-point performance compared to previous Exynos models and contemporaneous chips from Qualcomm. Benchmark suites from vendors and research groups—such as those similar to tools by Geekbench, AnTuTu, and academic benchmarks used at USENIX—showed gains in IPC and clock behavior. Performance scaling under sustained loads resembled observations reported for devices using competing SoCs from Apple Inc. and HiSilicon, and reviewers compared results to laptop-class measurements presented at CES and MWC Barcelona.
Graphics duties are handled by an ARM Mali-G72 MP18 GPU, an implementation related to ARM GPU architectures discussed by ARM Holdings and evaluated alongside GPUs from Imagination Technologies and NVIDIA. The multimedia pipeline integrates an ISP and video encoders/decoders to support HEVC, H.264, and VP9 codecs, paralleling multimedia feature discussions at IETF codec workshops and standards activity at MPEG meetings. Camera and image processing leverage neural and traditional pipelines referenced in publications from Google Research, Facebook AI Research, and imaging labs at Sony Corporation.
Power and thermal characteristics reflect process benefits from the 10 nm LPP node and system-level power management strategies similar to those implemented in devices from Samsung Electronics Mobile, Google Pixel, and OnePlus. Thermal throttling behavior and dynamic voltage-frequency scaling follow algorithms studied at IEEE Spectrum and presented at HotChips symposia. Battery life and heat dissipation in retail devices were compared against alternatives from Qualcomm Snapdragon and Apple A-series chips during reviews at technology shows such as IFA.
The Exynos 9810 includes an integrated LTE Cat.18 modem enabling high-speed downlink and uplink modes, comparable to integrated modem strategies pursued by Qualcomm and discrete modem approaches formerly used by Intel Mobile Communications. Wireless subsystem integration supports Wi‑Fi and Bluetooth profiles consistent with standards from Wi-Fi Alliance and Bluetooth SIG, and radio performance aligns with carrier testing practices by operators like Verizon, AT&T, Vodafone, and Deutsche Telekom.
Samsung deployed the Exynos 9810 in flagship models within the Samsung Galaxy S9 and regional variants of the Samsung Galaxy Note series, competing against devices that used processors from Qualcomm and Apple Inc.. Adoption patterns reflected Samsung’s dual-sourcing strategy and regional market considerations similar to historical device segmentation between Europe, North America, and Asia. Reviews and sales coverage from outlets such as The Verge, Engadget, TechRadar, and analysis by market firms like Gartner and IDC documented the chip’s role in Samsung’s product lineup.