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| Printed electronics | |
|---|---|
| Name | Printed electronics |
| Type | Technology |
| Inventor | Multiple |
| Introduced | 1990s–2000s |
| Components | Inks; substrates; printers; encapsulation |
Printed electronics is a suite of fabrication methods that use inkjet printing-like deposition, screen printing, gravure printing, and related techniques to create electronic devices on flexible and rigid substrates for applications ranging from smartphone accessories to satellite subsystems. The field integrates advances from organic chemistry, materials science, microfabrication, and industrial engineering to produce components such as transistors, light-emitting diodes, and sensor arrays with scalable, low-cost workflows. Development has been driven by collaborations among institutions such as MIT, Stanford University, Fraunhofer Society, and companies including HP Inc., Samsung Electronics, and DuPont.
Printed electronics emerged from research in organic semiconductors, conductive polymers, and thin-film deposition during the 1990s, intersecting with initiatives at Massachusetts Institute of Technology, University of Cambridge, and Sony Corporation. Early demonstrations combined patterning methods associated with flexography and rotogravure with novel functional inks developed at labs like Bell Labs and industrial research arms such as Xerox PARC. The approach emphasizes additive manufacturing, enabling integration with supply chains established by firms like Flextronics International and Jabil Inc. for consumer, medical, and industrial products.
Functional materials include metallic nanoparticle pastes developed by companies such as Cabot Corporation and Johnson Matthey, organic semiconductors studied at Max Planck Society labs, and dielectric polymers commercialized by DuPont. Conductive inks often rely on silver and copper nanoparticles synthesized in facilities influenced by protocols from IBM Research and Nissan Motor Company labs. Semiconducting inks derive from small molecules and polymers advanced by research groups at EPFL and Imperial College London, while emissive formulations connect to OLED work at LG Display and Pioneer Corporation. Encapsulation layers use barrier films from suppliers like 3M and Tesa SE to protect devices against moisture and oxygen, a challenge highlighted by tests developed at National Institute of Standards and Technology.
Additive techniques include inkjet printing refined by Seiko Epson and Canon Inc., screen printing standardized by manufacturers such as Schreiner Group, and gravure printing implemented at pilot lines run by IMEC and AIST. Laser sintering and photonic curing processes influenced by research at Lawrence Berkeley National Laboratory are applied to nanoparticle inks to achieve conductivity without thermal damage to substrates like polyethylene terephthalate used by Toray Industries. Hybrid approaches combine photolithography expertise from Tokyo Institute of Technology with roll-to-roll coating knowledge from Nippon Paper Industries.
Printed electronic devices include organic thin-film transistors (OTFTs) prototyped at University of Osaka, printed batteries developed by Toyota Motor Corporation researchers, and RFID antennas commercialized by Avery Dennison. Flexible displays leverage OLED technology advanced at Panasonic Corporation and printable sensors for wearables have been piloted in partnerships between Philips and Roche. Smart packaging initiatives involve collaborations with Walmart and Procter & Gamble, while printed photovoltaic modules link to projects at National Renewable Energy Laboratory and Sharp Corporation. Medical devices combine biosensing work from Johns Hopkins University with disposable diagnostics by Abbott Laboratories.
High-throughput roll-to-roll production lines have been deployed by manufacturers including Meyer Burger and Heliatek, using web-handling systems influenced by standards from International Electrotechnical Commission committees. Process modules integrate coating heads from Kansai Paint-affiliated suppliers, inline inspection solutions from KLA Corporation-style vendors, and curing ovens inspired by designs at Siemens. Scale-up efforts have been supported by consortia such as European Commission-funded programs and initiatives at DARPA, facilitating pilot fabs at Fraunhofer FEP and university cleanrooms at University of Michigan.
Reliability testing follows protocols adapted from ASTM International standards and accelerated aging studies pioneered at Sandia National Laboratories. Performance metrics compare printed devices against benchmarks from Intel Corporation and Texas Instruments for mobility, lifetime, and operational stability. Environmental stress tests and failure analysis use equipment from Thermo Fisher Scientific and methodologies taught at Massachusetts General Hospital for biocompatibility assessments when devices target healthcare markets.
Environmental assessments reference life-cycle analysis frameworks used by United Nations Environment Programme and European Environment Agency studies, particularly concerning nanoparticle lifecycle and solvent emissions regulated under directives influenced by REACH. Economic evaluations cite market analyses from McKinsey & Company and Gartner, Inc. that forecast adoption curves shaped by procurement policies at OEMs like Apple Inc. and BMW. Regulatory approval for medical and consumer applications involves agencies such as Food and Drug Administration and European Medicines Agency, while standards development engages bodies like IEEE and ISO.
Category:Electronics