Fraunhofer IISB

Fraunhofer IISB
Name	Fraunhofer IISB
Formation	1987
Type	Research institute
Headquarters	Erlangen, Bavaria, Germany
Region served	International
Parent organization	Fraunhofer Society

Fraunhofer IISB

Fraunhofer IISB is a German applied research institute specializing in semiconductor device development, power electronics, and optoelectronics headquartered in Erlangen, Bavaria. Founded within the framework of the Fraunhofer Society and closely connected to regional and national innovation ecosystems, the institute collaborates with industrial partners, universities, and research organizations to translate laboratory results into industrial products. Its work intersects with key European initiatives and multinational corporations across electronics, automotive, energy, and aerospace sectors.

History

The institute was established in 1987 amid expansion of the Fraunhofer Society and concurrent growth of the Bavarian high-tech cluster centered on Erlangen and Nuremberg. Early activities linked to pioneering efforts in wide-bandgap semiconductors followed contemporaneous research at the Max Planck Society and cooperative projects with the University of Erlangen–Nuremberg and the Helmholtz Association. Over time, strategic partnerships developed with multinational firms such as Siemens, Infineon Technologies, and Robert Bosch GmbH, while European research programs like Horizon 2020 and national initiatives including the German Federal Ministry of Education and Research funded collaborative projects. Milestones include technology transfers into products used in automotive drivetrains, renewable energy systems, and industrial automation, and cross-border collaborations with institutes such as CNR in Italy and CNRS in France.

Research Areas and Competences

Fraunhofer IISB focuses on semiconductor materials and device engineering with competencies spanning silicon, silicon carbide, and gallium nitride technologies, as well as photonic integration for optoelectronics. Its portfolio includes power-semiconductor design and reliability testing used by companies like STMicroelectronics and ON Semiconductor; microelectronic packaging approaches relevant for Intel and AMD; and sensor and MEMS development intersecting with Bosch Sensortec and TE Connectivity. Research programs often align with European calls such as Horizon Europe and engage partners including Fraunhofer ISE, Fraunhofer IIS, Fraunhofer IZM, and academic groups at Technical University of Munich. Competences include device simulation tools and methodologies influenced by work from IMEC, CEA-Leti, and Tyndall National Institute, reliability modeling used by VDE standards bodies, and power module integration approaches applied in Siemens Energy and ABB projects.

Facilities and Infrastructure

The institute maintains cleanroom fabrication facilities, characterization laboratories, and power testing rigs compatible with industrial pilot-line requirements and research-scale production. Equipment suites include electron-beam lithography systems comparable to those at NanoFab centers, scanning electron microscopes like those used at EMPA, and high-voltage test benches employed in collaborations with Fraunhofer IKTS. Its process infrastructure supports epitaxy for MOCVD and CVD growth, ion implantation similar to tools at CEA, and metallization and wafer-level packaging consistent with standards from JEDEC. The campus fosters shared labs and technology platforms that interface with university facilities at the University of Erlangen–Nuremberg and regional innovation nodes such as Erlangen Innovation Center.

Technology Transfer and Industry Collaboration

Technology transfer is executed through contractual research, licensing agreements, joint ventures, and spin-offs engaging partners like Infineon Technologies, Siemens, Daimler AG, and emerging startups in semiconductor equipment and power electronics. The institute has supported commercialization pathways analogous to successes at Fraunhofer-Gesellschaft spin-offs and technology incubators such as High-Tech Gründerfonds. Collaborative frameworks include participation in consortia with European Space Agency projects, contributions to standardization via IEC and ISO committees, and engagement with industry associations like ZVEI. Knowledge exchange channels include prototype development for original equipment manufacturers (OEMs), contract microfabrication services, and joint research centers modeled after public–private partnerships seen in collaborations with Fraunhofer IFF and Fraunhofer IZM.

Education and Training

IISB contributes to academic training by supervising graduate and doctoral students in cooperation with the University of Erlangen–Nuremberg, providing internships for engineering students from institutions such as the Technical University of Munich and RWTH Aachen University, and offering continuing education courses for professionals from Siemens, Bosch, and Infineon Technologies. It participates in structured doctoral programs similar to those at DAAD-funded graduate schools and hosts summer schools, workshops, and seminars with speakers from IEEE, SEMICON, and SPIE. The institute’s vocational training programs reflect dual-study models prominent in Bavaria and collaborate with regional chambers like the IHK.

Organizational Structure and Funding

Organizationally, the institute operates under the legal and governance frameworks of the Fraunhofer Society, with scientific departments, technology centers, and administrative units coordinating applied research, pilot production, and outreach. Funding sources are a mix of competitive grants from entities like the European Commission, national programs from the German Federal Ministry for Economic Affairs and Climate Action, contract research from corporations including Infineon Technologies and Siemens, and income from licensing and services. Strategic oversight involves advisory boards with representatives from academia, industry partners such as ABB and Daimler Truck, and regional government stakeholders from Bavaria.

Category:Fraunhofer Society