DAC 2017 — LLMpedia

DAC 2017
Name	DAC 2017
Genre	Conference
Location	San Francisco Convention Center
Country	United States
First	2017
Organizer	Association for Computing Machinery / IEEE
Attendance	Approx. 10,000

Contents

DAC 2017

DAC 2017 was the 54th annual Design Automation Conference held in 2017, bringing together professionals from Intel Corporation, IBM, NVIDIA, Cadence Design Systems, Synopsys and ARM Holdings to discuss electronic design automation and semiconductor design. The event featured keynote addresses from leaders associated with Google, Apple Inc., Microsoft, Facebook, and Amazon (company), alongside tutorials and panels involving researchers from Massachusetts Institute of Technology, Stanford University, University of California, Berkeley, Carnegie Mellon University, and California Institute of Technology.

Overview

The conference combined contributions from corporate labs such as Qualcomm, Broadcom Inc., Texas Instruments, Samsung Electronics, and TSMC with academic papers from institutions like University of Illinois Urbana-Champaign, Georgia Institute of Technology, Princeton University, University of Michigan, and Cornell University. It included sessions on topics connected to technologies promoted by ARM, Rambus, Marvell Technology Group, Xilinx, and Altera while featuring standards discussions involving IEEE Standards Association, JESD, and OpenPOWER Foundation. The meeting took place near landmarks such as Golden Gate Bridge, Ferry Building, Oracle Park, Union Square, and Moscone Center.

Keynote speakers represented a cross-section of industry and academia, with executives from Google's DeepMind, researchers from IBM Research, architects from NVIDIA Research, and innovators from Facebook AI Research. Presenters included representatives from Intel Labs, Apple Inc. silicon teams, leaders affiliated with Microsoft Research, and founders associated with startups backed by Sequoia Capital and Andreessen Horowitz. Academic keynote participants hailed from Stanford University, MIT, UC Berkeley, Caltech, and Carnegie Mellon University and collaborated with labs like Berkeley Wireless Research Center and MIT CSAIL.

The technical program encompassed peer-reviewed papers, panels, and tutorials covering areas tied to work from DARPA, NASA, European Space Agency, National Science Foundation, and Defense Advanced Research Projects Agency funding. Sessions included tracks on machine learning accelerators reflecting designs by Google's TPU teams, hardware security topics relevant to ARM TrustZone and Intel SGX, EDA improvements from Cadence and Synopsys, and emerging silicon photonics work linked to Corning Incorporated and Intel Photonics. Workshops addressed verification methods used at Bell Labs, synthesis techniques practiced at Xilinx and Altera, and low-power design strategies employed by Texas Instruments and Qualcomm.

The exhibition floor showcased hardware demonstrations from NVIDIA's GPU platforms, FPGA prototypes from Xilinx and Altera (company), system-on-chip solutions by ARM Holdings partners, and tools from Cadence Design Systems and Synopsys. Startups incubated by Y Combinator and funded by Kleiner Perkins exhibited novel accelerators, while manufacturing partners such as TSMC and GlobalFoundries displayed process nodes and packaging technologies tied to 3M materials and Intel packaging research. Demonstrations included collaborations with Google's Cloud teams, Amazon Web Services, Microsoft Azure, and NVIDIA DGX systems, and featured projects originating in labs like MIT Media Lab and CMU Robotics Institute.

Awards presented at the conference honored contributions from individuals and teams associated with Intel Corporation, IBM Research, NVIDIA Research, Cadence, and Synopsys. Best Paper and Test of Time recognitions acknowledged work from authors affiliated with Stanford University, UC Berkeley, MIT, Princeton University, and Cornell University. Industry achievement awards celebrated innovations tied to ARM, Qualcomm, Texas Instruments, Samsung Electronics, and research breakthroughs funded by NSF and DARPA.

The 2017 meeting influenced subsequent research agendas at Stanford University, UC Berkeley, MIT, and Carnegie Mellon University and guided product roadmaps at Intel, NVIDIA, Qualcomm, Samsung, and TSMC. Technologies discussed contributed to later deployments in data centers operated by Google, Facebook, Amazon, Microsoft, and Apple Inc., and informed standards activity within IEEE, JESD, and industry consortia such as Open Compute Project and OpenPOWER Foundation. The conference continued to serve as a nexus between academia, corporate R&D, and venture investors including Sequoia Capital, Andreessen Horowitz, Kleiner Perkins, Bessemer Venture Partners, and Accel Partners.