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ANSYS Mechanical

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ANSYS Mechanical
NameANSYS Mechanical
DeveloperANSYS, Inc.
Released1990s
Latest release2020s
Operating systemMicrosoft Windows, Linux
GenreFinite element analysis, Multiphysics
LicenseCommercial proprietary

ANSYS Mechanical ANSYS Mechanical is a commercial finite element analysis (FEA) application for structural, thermal, and multiphysics simulation used in engineering and research. It integrates with computational fluid dynamics, electromagnetics, and systems simulation tools to support product design workflows in industries such as aerospace, automotive, energy, and biomedical. The software is delivered by a corporation known for numerical simulation platforms and is widely adopted in both industry and academia.

Overview

ANSYS Mechanical provides solution capabilities for static, dynamic, thermal, nonlinear, and coupled-field problems, linking with external solvers and platforms to form simulation chains. It is positioned alongside products from companies and institutions such as Siemens AG, Dassault Systèmes, Altair Engineering, Autodesk, and COMSOL, and it competes in markets that include customers like Boeing, Airbus, Ford Motor Company, and General Electric. The tool is used within design cycles that intersect standards and bodies including ASME, SAE International, ISO, and IEEE.

History and Development

Development traces to numerical methods advances and commercial software evolution involving founders, researchers, and engineering firms from the late 20th century. The product lineage is entwined with computational research from institutions such as MIT, Stanford University, Imperial College London, ETH Zurich, and national laboratories like Sandia National Laboratories. Corporate milestones include mergers and acquisitions involving companies in the software and high-performance computing sectors, interactions with supercomputing centers such as Oak Ridge National Laboratory and Lawrence Livermore National Laboratory, and participation in consortia tied to standards bodies like NIST.

Key development drivers have been advances in finite element formulations from academics like John Argyris, Ray Clough, and Olga Aleksandrova (note: example researchers associated with FEA development), solver algorithms influenced by work at NASA, improved meshing inspired by research at CERN and Los Alamos National Laboratory, and the rise of parallel computing promoted by vendors like Intel, AMD, NVIDIA, and HPC integrators such as Cray Inc. and IBM. The product roadmap has evolved through releases incorporating multiphysics coupling, model-based systems engineering links to companies like PTC and Siemens PLM Software, and cloud-enabled delivery tied to providers including Amazon Web Services, Microsoft Azure, and Google Cloud Platform.

Features and Capabilities

Capabilities include linear and nonlinear structural analysis, transient dynamics, modal analysis, harmonic response, heat transfer, and contact mechanics. Advanced material modeling supports metals used by firms such as ArcelorMittal and Alcoa, composites designed by organizations like Hexcel and Toray Industries, and biomaterials studied at institutions including Johns Hopkins University and Mayo Clinic. Multiphysics coupling connects to CFD packages from providers like ANSYS, Inc.'s own fluid solvers as well as third-party tools such as OpenFOAM and electromagnetic solvers referencing work from CERN or Siemens Energy.

Preprocessing features include geometry interfaces to CAD systems from PTC, Siemens PLM Software, Dassault Systèmes, and Autodesk, along with meshing strategies influenced by research from INRIA and Imperial College London. Solver technologies exploit sparse and iterative algorithms developed in the context of research by Argonne National Laboratory and numerical libraries such as those originating from Netlib and projects influenced by LAPACK and PETSc.

Architecture and Integration

The architecture supports modular solvers, scripting APIs, and integration with system-level platforms. APIs and automation allow links with programming environments and frameworks like Python (programming language), MATLAB, ANSYS Workbench (note: product integration context), and enterprise PLM systems such as Teamcenter and Windchill. High-performance computing integration leverages clusters managed by scheduling systems like SLURM and resource managers from vendors such as Sun Microsystems (historic) and HPE.

Data interoperability is achieved through neutral formats and connectors aligned with standards promoted by organizations like ISO and ANSI, and through model exchange with software from Siemens AG, Dassault Systèmes, and PTC. Visualization and postprocessing workflows parallel tools developed at institutions such as Los Alamos National Laboratory and vendors including ParaView creators and The MathWorks.

Applications and Industry Use Cases

Common applications include structural validation for aircraft components used by Airbus and Boeing, crashworthiness analysis for automakers such as Toyota and General Motors, thermal management in electronics for companies like Intel and NVIDIA, and fatigue life prediction in energy turbines manufactured by Siemens Energy and GE Power. Medical device designers at firms such as Medtronic and Stryker use the software for implant analysis in collaboration with academic centers like Harvard Medical School and Imperial College London.

Other use cases cover offshore engineering for companies like Schlumberger and TechnipFMC, civil infrastructure projects involving contractors such as Bechtel and AECOM, and defense applications pursued by agencies like DARPA and contractors including Lockheed Martin and Northrop Grumman.

Licensing and Editions

Licensing models are commercial and may include node-locked, floating, and enterprise options provided through corporate sales channels and resellers. Editions and module bundles target sectors represented by customers such as NASA, European Space Agency, and multinational manufacturers like Siemens AG. Purchasing often involves negotiations with corporate accounts, academic licensing for universities such as Massachusetts Institute of Technology and University of Cambridge, and collaborations with national research labs.

Training, Support, and Community Resources

Training and certification programs are offered through corporate training centers, authorized partners, and academic consortia including Coursera-style platforms and university extension programs at Stanford University and MIT Professional Education. Support ecosystems include user forums, technical customer support, and conferences where practitioners from SAE International, ASME, and IEEE present case studies. Community resources span online repositories, professional societies like SNAME and AIAA, and workshops hosted by industry events such as Hannover Messe and Paris Air Show.

Category:Finite element software