HiSilicon

HiSilicon. It is a Chinese semiconductor and integrated circuit design company, established in 2004 as a wholly-owned subsidiary of the multinational technology giant Huawei. The company specializes in designing system on a chip (SoC) and application-specific integrated circuit (ASIC) solutions, which are critical components for a wide array of telecommunications and consumer electronics. Its products have been central to the technological advancement and global competitiveness of its parent company, particularly in the face of significant international trade restrictions.

History

The company was founded in Shenzhen to internalize Huawei's semiconductor design capabilities, reducing reliance on external suppliers like Qualcomm and Broadcom. Early developments focused on chips for network infrastructure, such as ASICs for routers and base stations. A major milestone was reached in 2012 with the launch of the Kirin 910, its first significant mobile SoC, which debuted in Huawei's Ascend P1 S smartphone. The subsequent years saw rapid iteration, with the Kirin 950 in 2015 garnering attention for its performance and integration of a Cortex-A72 core. The entity's growth trajectory was significantly altered by the U.S.-China trade war and the placement of Huawei on the Entity List by the United States Department of Commerce in 2019, which cut off access to advanced semiconductor manufacturing from partners like Taiwan Semiconductor Manufacturing Company (TSMC).

Products

Its product portfolio is divided into several key lines. The Kirin series of mobile SoCs, such as the Kirin 9000 and Kirin 990 5G, powered flagship Huawei smartphones like the Huawei P40 and Mate 40 series. For data centers and cloud computing, it developed the Kunpeng series of ARM-based server processors and the Ascend series of AI accelerators for artificial intelligence workloads. In the realm of connectivity, it produces the Balong series of modem chips, including the Balong 5000 for 5G networks. Additional product families include the Honghu series for smart displays and Tiangang series for Internet of Things (IoT) applications.

Design and development

The company operates as a fabless semiconductor company, meaning it handles the design and architecture of its chips but contracts the manufacturing, or semiconductor fabrication, to external foundries. Its designs are predominantly based on the ARM architecture, utilizing ARM Cortex-A CPU cores and Mali GPUs licensed from ARM Holdings. The design process involves extensive electronic design automation (EDA) software from companies like Synopsys and Cadence Design Systems. Following the 2019 sanctions, its development faced severe challenges, including the inability to produce advanced nodes at TSMC and restrictions on acquiring new EDA tools, prompting a strategic pivot toward legacy node innovation and diversification into less sanction-affected areas like automotive chips.

Relationship with Huawei

As a critical internal supplier, its operations are deeply integrated with the strategic goals of Huawei. Its chips are designed specifically for Huawei's product ecosystems, including smartphones under the Huawei Mate and Huawei P series, 5G base stations, and enterprise servers. This vertical integration strategy was designed to create technological independence and supply chain security. The financial and R&D support from Huawei has been substantial, with the parent company consistently ranking among the top global spenders in research and development according to the European Union's Industrial R&D Investment Scoreboard.

Impact and market position

Prior to international sanctions, it had become a major player in the global semiconductor industry, with its Kirin chips competing directly with those from Apple (Apple silicon), Qualcomm (Snapdragon), and Samsung Electronics (Exynos). Its advancements in 5G integration, showcased in the Balong 5000, positioned Huawei as a leader in next-generation telecommunications. The U.S. sanctions, however, dramatically curtailed its ability to manufacture cutting-edge designs, causing Huawei's global smartphone market share to decline and shifting the competitive landscape. Its experience has intensified national efforts within China, such as those promoted by the State Council of the People's Republic of China, to achieve self-sufficiency in semiconductor production through initiatives like the China Integrated Circuit Industry Investment Fund.

Category:Semiconductor companies Category:Companies based in Shenzhen Category:Huawei